ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,908, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device" was invented by Anthon... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,909, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Multi-TIM packages and method formi... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,911, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Eu... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,912, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Sungg... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,913, issued on Aug. 18, was assigned to DYNEX SEMICONDUCTOR Ltd. (Lincoln, Great Britain) and ZHUZHOU CRRC TIMES SEMICONDUCTOR Co. LTD (Zhuz... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,914, issued on Aug. 18, was assigned to The Board of Trustees of the Leland Stanford Junior University (Stanford, Calif.). "Structured micr... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,915, issued on Aug. 18, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas). "Microchannel structures with buried structures... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,916, issued on Aug. 18, was assigned to Mitsubishi Electric Corp. (Tokyo). "Resin-sealed semiconductor device" was invented by Ryuichi Ishi... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,917, issued on Aug. 18, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "Microfluidic channels for cooling hy... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,918, issued on Aug. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Thermal test chip with stackable metal based heater and sensor" w... Read More